SiC - Silicon Carbide Wafer Precision CNC Multifunctional Cylindrical Grinding Machine Start Testing

YUHUAN Start Testing a New Model YHMGK1720 Precision CNC Multifunctional Cylindrical Grinding Machine.

This Precision CNC Multifunctional Cylindrical Grinding Machine YHMCK1720 Can Grinding the

SIC or Sapphire Wafer ,which the Diameter  of it can support φ100~φ210mm,The Width Range 

will be about 10~500mm.Cylindrical precision can be 0.01mm.